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BALD Engineering News Blog

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Probably The Best ALD news blog. Covering new and old developments in Atomic Layer Deposition and Technology. From BALD Engineering:

SENTECH Plasma Process Technology Seminar 2014 Feb. 27th

Workshops Posted on 2014-02-01 09:46:49

Sentech ( announces that “In good tradition
SENTECH is glad to announce its annual Plasma Seminar which takes place on
Thursday, February 27th, 2014 at SENTECH Instruments GmbH, Schwarzschildstraße
2, Berlin Adlershof.

As the global
interest in Nanotechnology is growing, we want to get our participants
introduced to new topics in fields of deposition and etching combined with
recent examples. Invited speakers will focus on topics such as the deposition
through ALD and PE-ALD, the etching of micro- and nanostructures in Si, the
manufacturing of graphene films and the deposition of passivation and
encapsulation films through IC PECVD and ALD. The whole Seminar Program can be
downloaded here: Programme_SENTECH
Plasma Seminar
. If you want to
participate please send this Registration for SENTECH`s Plasma Process
Technology Seminar

After the seminar
there will be a presentation of the SENTECH application laboratories and its
production facilities. The whole material of this seminar will be provided for
all participants.

For further
information don`t hesitate to contact us or call: +49 89 8979607-0″

The SEMATECH ALD equipment forum will run from February 17th-20th in San Diego

Workshops Posted on 2014-01-31 15:08:34

The SEMATECH ALD equipment forum will run from February 17th-20th in San Diego and will focus on the following topics:

– Equipment Cost of Ownership
– Defect Reduction
– Precursor Qualification
– Maintenance Best Practice
– Process Control / FDC

This forum is being supported by HKE, TEL and others; with high volume manufacturing Fab engineers participating from: Intel, IBM, Samsung, UMC, Winbond, Macronix, GlobalFoundries, TSMC, Renesas, Freescale and HP. We are focusing on both oxides and metal nitrides.

2014.03.24 – NaMLab, The Novel High k Application Workshop

Workshops Posted on 2014-01-12 00:11:16

Hörsaal TU Dresden Fakultät Informatik:

Nöthnitzer Straße 46 D-01187 Dresden

(between Namlab and the MPI last year)

Preliminary Program for the Workshop coming soon

2014.02.06 – The 4th IPMS-CNT Industry Partner Day

Workshops Posted on 2014-01-12 00:02:42

Fraunhofer IPMS-CNT cordially invite to “Nanoelectronic Technologies for Future Smart Systems” in Dresden. This time with high-level speakers from Globalfoundries, IBM, Infineon, IMEC and JSR Mirco. Full program and online registration behind the link.

Get Together & CNT Clean Room Window Tour (limited capacity!)

Programm & Schedule:

8:30 a.m. -Registration-
9:00 a.m. WelcomeProf. Dr. Hubert Lakner, Director Fraunhofer IPMS, Chairman Fraunhofer Group Microelectronics
9:15 a.m. Cooperation is Key – R&D perspectives at Globalfoundries Dresden, Dr. Manfred Horstmann, Director Technology & Integration, Device – Globalfoundries
9:45 a.m. Made in Dresden – Infineon Today & Tomorrow, Dr. Norbert Thyssen, Director Customer Services / Dvmt. Projects – Infineon
10:15 a.m. Coffee Break

Session: Devices in Back-End-of-Line

10:40 a.m.Challenges for 28 nm BEOL, Thomas Werner, Manager Technology & Integration Engineering – Globalfoundries
11:05 a.m. Chemical screening for CMP applications, Peter Bridger, CMP Project Manager – JSR Micro, Belgium
11:30 a.m. CNT as test bed for chemical screening, Dr. Benjamin Uhlig, Fraunhofer IPMS-CNT Interconnects
11:55 a.m. High-k 3DMIM-Cap Devices, Dr. Wenke Weinreich, Fraunhofer IPMS-CNT High-k Devices
12:20 p.m.-Lunch Break-

Session: Logic & Memory Scaling

1:00 p.m. New front-end materials for continued CMOS logic scaling, Dr. Martin M. Frank, BM Research/New York
1:25 p.m. RRAM – Challenges and Opportunities of an Emerging Memory, Dr. Malgorzata Jurczak, Director Emerging Memory Devices – IMEC Belgium
1:50 p.m. A CMOS-compatible and highly scalable approach to future ferroelectric memories, Johannes Müller, FraunhoferIPMS-CNT High-k Devices)
2:15 p.m. -Short Coffee Break-

Session: MEMS, Passives & Nanopatterning

2:25 p.m. Nanopatterning using alternative Litho, Dr. Christoph Hohle, Fraunhofer IPMS-CNT Nanopatterning
2:50 p.m. MEMS-Technology at Fraunhofer IPMS, Dr. Michael Müller, IPMS MEMS Sensors)
3:15 p.m. -End of Program-