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BALD Engineering News Blog

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Probably The Best ALD news blog. Covering new and old developments in Atomic Layer Deposition and Technology. From BALD Engineering:

JUSUNG ENGINEERING to introduce ‘Space Divided Plasma System’

ALD Equipment Posted on 2014-01-30 15:57:47

AVING NET reports that JUSUNG ENGINEERING( to introduce its semiconductor product including ‘Space Divided Plasma System'(SDP), which features largely three functions which are ‘ALD’, ‘CVD’ and ‘Treatment’ for Nitridation, Oxidation and Doping. The system is capable to go through the process of ordinary PECVD, LPCVD and Defusion Furnishing, which can solve wafer damage problem by plasma.

Image from AVING NET – Jusung SDP – Space Divided Plasma System

SEMICON Korea 2014

▶ February 12(Wen) – 14(Fri), 2014

▶ Venue: Hall A, B, C, D 1F&3F, COEX, Seoul, Korea

▶ Program: Exhibition, SEMI Technology Symposium

▶ Program: Press Conference, imec Technology Forum, Keynote Speech, Executive Forum, SEMI Technology Symposium(STS), LED Korea Conference 2014.

▶ Organized by: SEMI (Semiconductor Equipment and Material International)

LAM Research sees a transition to single wafer atomic layer deposition (ALD) tools for multi-patterning as the film conformality and uniformity requirements increase

ALD Equipment Posted on 2014-01-30 12:58:23

As reported by Seeking
Alpha – Lam Research Management Discusses Q2 2014 Results – Earnings Call
Transcript :

“In DRAM, the number of multi-patterning
steps more than doubles with the transition to 20-nanometer going from 3 or 4
in a mid-2x device to between 8 and 10 at 20-nanometer, with the same evidence
of upsize on number of passes. You should expect more specificity from Lam on
this in the coming quarters. This transition also presents growth opportunities for our deposition business. Many of the spacer-based, multi-patterning deposition steps can be done with batch variances today. However, customers are evaluating or starting to transition these steps to single wafer atomic layer deposition, or ALD tools, as the film conformality and uniformity requirements increased.”

Access the full transcript thru Seeking Alpha

Jan. 29, 2014 9:50 PM ET