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BALD Engineering News Blog

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Probably The Best ALD news blog. Covering new and old developments in Atomic Layer Deposition and Technology. From BALD Engineering:

Silicon capacitors: a new solution for decoupling applications

Capacitor Posted on 2014-01-22 10:43:02

EE Times Europe reports on Silicon Capacitors as new solutions for decoupling applications.

“As consumers are eager to get the most cutting-edge products, manufacturers have to adapt their technologies and continue to drive innovations to offer the most advanced electronic equipment.

Two key features must often be considered for electronic devices: size and performance. In order to anticipate the demand for more miniaturization and signal integrity over a wide range of frequencies in the decoupling applications, IPDiA adds to its silicon passive component library some ultra low ESR/ESL structures, in low profile form factor. These new silicon capacitors enable to drastically decrease the overall impedance and offer the best solution for decoupling performances up to 10 GHz frequency range.”

A Mosaïc PICS capacitor design that can be embedded in a PCB.

Read the full article on page 32 of our January digital edition or download the PDF of this article directly here

Fraunhofer IPMS-CNT is developing new materials and processes for future generations of PICS in the EU project PICS for IPDIA together with CEA/Leti, Sentech and Picosun. Read more in a previous blog post here.

Picosun Develops ALD for Graphene-Based Displays and Electronics

Atomic Layer Deposition (ALD) Posted on 2014-01-22 07:08:35

According to a press realise today from Picosun (Kyrkslätt, Finland) Picosun is taking part in a European research project to develop ALD for graphene-based displays and electronics. The development work for ALD-processing of graphene is a part of the EU 7th Framework Program project QUANTIHEAT (“QUANTItative scanning probe microscopy techniques for HEAT transfer management in nanomaterials and nanodevices”). New ALD equipment and process development is an integral part of the project.

Read more here

QUANTIHEAT is coordinated by CNRS (France) and project partners are NPL, Kelvin NanoTech, Univ. Lancaster and Univ. Glasgow (UK), IBM and EPFL (Switzerland), Thales TRT, LNE, ESPCI, FEMTO-ST and Univ. Reims (France), VTT and Picosun (Finland), CMI (Czech Republic), ICN (Spain), > MRT (Germany), Conpart (Norway), NT-MDT (Netherlands)